AS(AmericanSamoa) pcb manufacturing,multilayer pcb manufacturing in AS(AmericanSamoa)

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  • Time：2023-11-27
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We have extensive experience in the manufacturing of printed circuit boards (PCBs) that are tailored to meet the diverse needs of different industries and applications. Our specialization lies in the production of a wide range of PCB types, including 1-20 layer high-density impedance, blind/buried, HDI, high frequency, high TG, aluminum, and heavy copper PCBs. These PCBs have gained widespread popularity and are extensively utilized in fields such as communication, medical equipment, consumer electronics, vehicle electronics, and more. We are dedicated to upholding the highest standards of quality and employ advanced manufacturing techniques to ensure that our PCBs adhere to the stringent requirements of these industries. By offering reliable and high-performance solutions, we aim to provide our customers with the best PCB products available.

AS(AmericanSamoa) pcb manufacturing

pcb manufacturing Types

HDI PCB

HDI PCB manufacturing

HDI PCBs are a type of multilayer PCB that utilizes advanced technologies to achieve higher circuit density and miniaturization. They incorporate microvias and high-density routing to accommodate complex and densely packed components.

Rigid-Flex PCB

Rigid-Flex PCB manufacturing

Aluminum PCB, also known as Metal Core PCB, is a type of printed circuit board that uses an aluminum base material. It possesses unique characteristics and application advantages compared to traditional substrate materials such as FR-4. The structure of a

Aluminum PCB

Aluminum PCB manufacturing

Aluminum PCB, also known as Metal Core PCB, is a type of printed circuit board that uses an aluminum base material. It possesses unique characteristics and application advantages compared to traditional substrate materials such as FR-4.

Multilayer PCB

Multilayer PCB manufacturing

Multilayer PCB (Printed Circuit Board) refers to a type of PCB that consists of multiple layers of conductive traces and insulating material stacked together. Unlike single-layer or double-layer PCBs, which have only one or two layers of conductive materi

Heavy Copper PCB

Heavy Copper PCB manufacturing

Heavy Copper PCB refers to a type of printed circuit board that features a significantly thicker copper layer compared to standard PCBs. The copper thickness in heavy copper PCBs typically ranges from 3 ounces (105 micrometers) to 20 ounces (700 micromete

Steps of the PCB manufacturing process

PCB production process mainly includes design, graphic conversion, plate making, etching, drilling, coating, welding, testing and cleaning steps.

Design phase
The design stage is the starting point of PCB production, and the circuit schematic and PCB layout are designed through CAD software to determine the size of the PCB board, the routing method, the size of the pad and other information.
Graphic conversion phase
After the design is completed, the circuit schematics and PCB layout diagrams need to be converted into Gerber files for processes such as plate making and etching.
Plate making stage
Plate making is the core link in PCB production, by converting the Gerber file into a photoresist film, and then through exposure, development and other processes to transfer the photoresist film graphics to the copper foil, to make the PCB board line and graphics.
Etching stage
Etching is the process of removing the unnecessary copper foil part, by soaking the copper foil after plate making in the etching agent, waiting for a certain time, the excess copper foil is etched away, forming the PCB circuit and graphics.
Drilling stage
Drilling refers to drilling a variety of holes on the PCB board, including pad holes, positioning holes, installation holes, and so on. Drilling requires the use of a drill press or drill machine to operate.
Coating stage
Coating is to remove the photoresist film on the copper-clad plate, and then cover a layer of welding film through the process of drying, exposure, etc., in order to carry out subsequent welding operations.
Welding phase
Welding is the process of installing components to the PCB board and welding them. Soldering iron or welding equipment is required during the welding process.
Detection phase
Inspection is the process of quality inspection of welded PCB board, mainly including AOI inspection, X-ray inspection, ICT inspection and so on.
Cleaning phase
Cleaning is the process of cleaning the welded PCB board for subsequent packaging and assembly operations.

pcb manufacturing Why Choose Semshine

Customer service
A special customer service team contacts customer, offers quick response and provides return and refund service.

Delivery
Before delivery, the item number, customer code, quantity and consignee etc must be fully checked by the PQA.

Test of finish product
Open/short, visual inspection and physical testing.Flying probe,ICT,and functional testing.

Control in Manufacturing
The factory has advanced automatic production line which reduces manual damage to boards.

Pre-production Arrangement
The engineer checks the customer's design information, makes the production documents twice and is confirmed by the customer.

PCB manufacturing workshop

  • PCB FACTORY PCB manufacturing workshop
  • PCB FACTORY PCB manufacturing workshop
  • PCB FACTORY PCB manufacturing workshop
  • PCB FACTORY PCB manufacturing workshop

PCB Manufacturer Capabilities

Category

Description

Capability

File Formats

Gerber files- preferred

Gerber file 274-X or ODB++

  Drill file

  3.3  leading  mm

Size

Max. finished PCB dimensions

  400mm x 1200mm – Single/ Double-sided

  600mm x 700mm – Multilayer

Board Thickness

  Standard

  1.6mm ±10%

Min.

  0.6mm ±10%

Max.

  3.2mm ±10%

  Bow and twist

  0.50%

Copper Thickness

Outer Cu weight

  0.5oz-12oz

  Inner Cu weight

  0.5oz-12oz

Laminate Materials

  FR4(KB, ILM, Shengyi, Huazheng new material ) ,
   High TG, Aluminum plate( Taiwan)


Board Cutting

Max. number of layers

  20

Min. thickness for inner layers (Cu thickness are
   excluded)

  0.05mm

Drilling

Min. size

  0.20mm

Max. size

  6.00mm

Drill Deviation

  ±0.075mm

NPTH hole tolerance

  ±0.05mm

Angle of Countersink

  45°

PTH

Min. hole size

  0.20mm

Aspect ratio

  8:1

Etching

Trace width tolerance

  ±20%

Min. trace width / space (1oz finished Cu weight
starting from 1/3oz)

  75um/75um  (3mil/3mil)

Min. trace width / space  (1oz finished Cu weight
starting from 1/2oz)

  89um/89um  (3.5mil/3.5mmil)

Min. trace width / space (2oz finished Cu weight)

  150um/150um  (6mil/6mil)

Solder Mask

 Color

Green,White,Black,Red,Blue,Etc.

Min. solder mask clearance

  3mil

Thickness

  Line angle:8um(min),Linear plane:10um(min),
   base material:20-50um

Silkscreen

Color

White,Black,Etc.

Min. trace width

  100um 4mil

Min. size

  0.7mm 28mil

Test

AOI

  100%

Flying Probe Tester

  Sample 100%

E-test

Mass order 100%

Controlled Impedance

Tolerance

  +/-10%

Impedance tester

  Test impedance module

Profile

Tolerance

  ±0.10mm

V—CUT Depth

  ±0.10mm

V—CUT angle deviation

  30°

Semi-hole

Minimum half hole:0.40mm

Surface Finish

HASL,Immersion gold(ENIG),OSP


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